Various types of grinding and abrasives are used when working with electronic materials. Based on the necessary parameters, multiple nozzle designs were created to incorporate Saint Gobain's patented nozzle profile on the high precision slicing machine used there. The standard nozzle and the new designs were analyzed after slicing glass wafers to allow for the analysis of the following to determine the best design: Chip removal rate/Kerf width; Wear on the grinding wheel; Power; Chip size; and Bottom/top edge comparison.

• This report represents the work of one or more WPI undergraduate students submitted to the faculty as evidence of completion of a degree requirement. WPI routinely publishes these reports on its website without editorial or peer review.

Creator

• LeBlanc-Shoemaker, Robert Francis
• Melendez, Gina

Publisher

• Worcester Polytechnic Institute

Identifier

• E-project-042607-085657

Advisor

• Rong, Yiming

Year

• 2007

Sponsor

• Saint Gobain

Date created

• 2007-04-26

Resource type

• Major Qualifying Project

Major

• Mechanical Engineering

Rights statement

• In Copyright