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die warpage
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A Selective Encapsulation Solution For Packaging An Optical Micro Electro Mechanical System
Keyword:
die warpage
,
die bow
,
electronics
,
wirebonds
,
encapsulate
,
MEMS
,
packaging
,
micro electro mechanical systems
,
encapsulant
,
Corrosion
, and
electrochemical migration
Creator:
Bowman, Amy Catherine
Advisor:
Sisson, Richard D.
Publisher:
Worcester Polytechnic Institute
Date Created:
2002-01-08
Resource Type:
Thesis
Degree:
MS
Unit (Department):
Materials Science & Engineering
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Masters Theses
1
Year
2002
1
Creator
Bowman, Amy Catherine
1
Advisor
Sisson, Richard D.
1
Contributor
Sisson, Richard D.
1
Unit (Department)
Materials Science & Engineering
1
Publisher
Worcester Polytechnic Institute
1
Resource type
Thesis
1
