This work developed a process to provide physical, electrical, and environmental protection to the electrical lead system of an optical switch device. A literature review was conducted to find materials and processes suitable to the stress-sensitive, high voltage characteristics of many optical switch devices. An automatic dispensing dam and fill process, and three candidate materials (two epoxy and one silicone) were selected for investigation. Experimental and analytical techniques were used to evaluate the materials. Methods applied included interferometric die warpage measurements, electrochemical migration resistance tests (ECMT), thermal cycling, and finite element analysis. The silicone dam and fill system was selected based upon the results of die warpage and electrochemical migration resistance tests. A modified, selective dam and fill process was developed and preliminary reliability testing was performed. The paper provides detailed instructions for successful encapsulation of the optical switch’s lead system.

Creator

• Bowman, Amy Catherine

Contributors

• Sisson, Richard D.

Degree

• MS

Unit

• Materials Science & Engineering

Publisher

• Worcester Polytechnic Institute

Language

• English

Identifier

• etd-0108102-140953

Keyword

• die warpage
• die bow
• electronics
• wirebonds
• encapsulate
• MEMS
• packaging
• micro electro mechanical systems
• encapsulant
• Corrosion
• electrochemical migration

Advisor

• Sisson, Richard D.

Defense date

• 2002-01-03

Year

• 2002

Date created

• 2002-01-08

Resource type

• Thesis

Rights statement

• In Copyright

Last modified

• 2023-11-07