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- Keyword:
- die warpage, die bow, electronics, wirebonds, encapsulate, MEMS, packaging, micro electro mechanical systems, encapsulant, Corrosion, and electrochemical migration
- Creator:
- Bowman, Amy Catherine
- Advisor:
- Sisson, Richard D.
- Publisher:
- Worcester Polytechnic Institute
- Date Created:
- 2002-01-08
- Resource Type:
- Thesis
- Degree:
- MS
- Unit (Department):
- Materials Science & Engineering