Analysis of the thermo-mechanical reliability of an SMT attachment Public
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Microsystems and microelectronics are new technologies that are being increasingly integrated into everyday life. Some of the main concerns in the reliability of micro-electronics are the solders, leads and packages within the systems. Our MQP involved the observation, testing, and analysis of the different failures that occur in surface mount technology (SMT). We have conducted extensive literary research on the history of SMT, what failures and issues commonly occur, and how failures and issues are being addressed. Lastly, we used finite element analysis (FEA) software to test failures due to, but not limited to, vibrations, thermal expansion mismatch, and material properties. We correlated the results of our modeling with laboratory testing and supportive detailed uncertainty analysis.
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