RF MEMS cantilever beam switches have many applications; however the residual stress built into these devices during fabrication constricts their use. During fabrication, the electroplating process was believed to be the main culprit of stress. The temperature and the time, which affects the bridge thickness, were varied. It was found that as both the temperature and thickness increased the residual stress increased. The residual stress observed was due to temperature gradients as well as chemical stability of the plating solution.

• This report represents the work of one or more WPI undergraduate students submitted to the faculty as evidence of completion of a degree requirement. WPI routinely publishes these reports on its website without editorial or peer review.

Creator

• Thomas, Stephanie Caitlyn

Publisher

• Worcester Polytechnic Institute

Identifier

• 04D108M

Advisor

• Furlong-Vazquez, Cosme
• Datta, Ravindra

Year

• 2004

Date created

• 2004-01-01

Resource type

• Major Qualifying Project

Major

• Chemical Engineering

Rights statement

• In Copyright

Last modified

• 2021-10-11