Student Work

 

Analysis of Orientation, Bond Thickness, and Bond Force of a Single Layer Cubic Boron Nitride Grinding Grain Public

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Currently, Saint-Gobain Abrasives team uses the Chemical Mechanical Planarization (CMP) process to manufacture multiple products. Cubic Boron Nitride grain orientation has not been optimized which could increase the life of the conditioning pad integral to the CMP process. Our team designed a set of experiments to obtain the optimal grain angle to increase the maximum bonding force thus increasing the life of the conditioner tool. We analyzed each new angle and assembled a final optimal grain orientation.

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  • E-project-041014-132709
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Year
  • 2014
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Date created
  • 2014-04-10
Location
  • Wuhan
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Permanent link to this page: https://digital.wpi.edu/show/jh343t89b