Student Work
Analysis of Orientation, Bond Thickness, and Bond Force of a Single Layer Cubic Boron Nitride Grinding Grain
PublicCurrently, Saint-Gobain Abrasives team uses the Chemical Mechanical Planarization (CMP) process to manufacture multiple products. Cubic Boron Nitride grain orientation has not been optimized which could increase the life of the conditioning pad integral to the CMP process. Our team designed a set of experiments to obtain the optimal grain angle to increase the maximum bonding force thus increasing the life of the conditioner tool. We analyzed each new angle and assembled a final optimal grain orientation.
- This report represents the work of one or more WPI undergraduate students submitted to the faculty as evidence of completion of a degree requirement. WPI routinely publishes these reports on its website without editorial or peer review.
- Creator
- Publisher
- Identifier
- E-project-041014-132709
- Advisor
- Year
- 2014
- Center
- Sponsor
- Date created
- 2014-04-10
- Location
- Wuhan
- Resource type
- Major
- Rights statement
- License
Relations
- In Collection:
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Final_MQP_Paper_Saint_Gobain.pdf | Public | Download |
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