Student Work
Modification of Microcontact Printing Process for Adhesive and Conductive Ink Printing
PublicContenu téléchargeable
open in viewerThis project applied the mechanical and chemical characteristics of Microcontact printing to adapt the current printing process at NTB to pattern adhesive and conductive epoxies on non-standard substrates. The process development focused on implementing new methods and process parameters to produce a thin and uniform layer of epoxy. To ensure a reproducible and optimal printing process, a series of printing trials were conducted and the final printed adhesives were characterized.
- This report represents the work of one or more WPI undergraduate students submitted to the faculty as evidence of completion of a degree requirement. WPI routinely publishes these reports on its website without editorial or peer review.
- Creator
- Publisher
- Identifier
- E-project-101316-072517
- Advisor
- Year
- 2016
- Center
- Sponsor
- Date created
- 2016-10-13
- Emplacement
- Zurich
- Resource type
- Major
- Rights statement
Relations
- Dans Collection:
Contenu
Articles
La vignette | Titre | Visibilité | Embargo Release Date | actes |
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Buchs_MQP_A16.pdf | Public | Télécharger | ||
Buchs_MQP_A16_Deliverable.pdf | Public | Télécharger |
Permanent link to this page: https://digital.wpi.edu/show/hd76s1711