Development of high performance MEMS and MEMS packaging requires significant testing to ensure reliability of the finished products. To facilitate testing and characterization of MEMS and their packaging, a system capable to provide necessary information is required. Such a system should allow a full-field-of-view noninvasive characterization of MEMS with high spatial resolution and nanometer measurement accuracy, while allowing the packing to be subjected to various environmental and operational conditions. This report describes development of a system that allows quantitative characterization of MEMS and their packaging placed in a climate chamber and subjected to a range of environmental and operational conditions. Use of this compact optoelectronic system is illustrated by representative applications addressing determination of absolute shape and deformation of MEMS and MEMS packaging subjected to time varying thermomechanical loads.

• This report represents the work of one or more WPI undergraduate students submitted to the faculty as evidence of completion of a degree requirement. WPI routinely publishes these reports on its website without editorial or peer review.

Creator

• Klempner, Adam Robert

Publisher

• Worcester Polytechnic Institute

Identifier

• 03D113M

Advisor

• Pryputniewicz, Ryszard J.

Year

• 2003

Date created

• 2003-01-01

Resource type

• Major Qualifying Project

Major

• Mechanical Engineering

Rights statement

• In Copyright