The goal of this project was to adhere miniature circuit chips to flex prints using conductive epoxy and microcontact printing techniques. To accomplish this goal, the printing process was first optimized. Tool properties were varied to determine their influence on final print quality. Optimized parameters included ideal ranges for inking force and acceptable alignment during inking. The prints created with the optimized parameters were used to bond substrates for shear resistance and electrical conductivity tests. Both tests showed that using microcontact printing to apply conductive epoxy for establishing continuity has potential to become an alternative solution for bonding electrical components.

• This report represents the work of one or more WPI undergraduate students submitted to the faculty as evidence of completion of a degree requirement. WPI routinely publishes these reports on its website without editorial or peer review.

Creator

• Dowling, Michaela
• Cyran, Adam J

Publisher

• Worcester Polytechnic Institute

Identifier

• E-project-110217-230300

Advisor

• Wodin-Schwartz, Sarah Jane

Year

• 2017

Center

• Zurich, Switzerland Project Center - MQP

Sponsor

• NTB: Interstaatliche Hochschule fur Technik Buchs

Date created

• 2017-11-02

luogo

• Zurich

Resource type

• Major Qualifying Project

Major

• Mechanical Engineering

Rights statement

• In Copyright