Structural and Functional Integration Studies of POL Technology for SiC-based Integrated Modular Motor Drive Development
Öffentlich DepositedThis project sought to perform a thorough thermo-mechanical assessment of a SiC power overlay (POL) bi-directional switch for the purpose of determining the fitness of this novel power electronics technology for the application of integrated modular motor drives. This goal was accomplished by performing a thermo-mechanical comparative study using Finite Element Analysis (FEA) between the emerging POL architecture and traditional wire bonding techniques, and by performing electro-thermal characterization and reliability studies. This goal was further extended to define foundational bases for integrational studies of the device in IMMDs through a DOE-based optimization study. This project was able to affirm that POL can maintain the thermal performance of wire bond interconnections to a margin of 1% while significantly reducing the thermal stress at previously considered weakness points such as the sintering layer. This FEA study was also able to reduce the BDS volume by over 56% while maintaining its performance well under its 200℃, 9GPa threshold. As a result of these findings, several follow-up studies aimed at benchmarking the device’s performance, integrating it in IMMD, and verifying its performance through physical experimentation were suggested.
- This report represents the work of one or more WPI undergraduate students submitted to the faculty as evidence of completion of a degree requirement. WPI routinely publishes these reports on its website without editorial or peer review.
- Creator
- Subject
- Publisher
- Identifier
- 117318
- E-project-011924-122809
- Stichwort
- Advisor
- Year
- 2024
- Center
- Sponsor
- UN Sustainable Development Goals
- Date created
- 2024-01-19
- Resource type
- Major
- Source
- E-project-011924-122809
- Rights statement
- Zuletzt geändert
- 2024-02-07
Beziehungen
- In Collection:
Objekte
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