Particle Motion During Magnetron Sputter Deposition Public
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Magnetron sputter deposition is integral in the creation of semiconductor devices like integrated computing chips and electron microscope slides. The goal of this project was to characterize target erosion during the magnetron sputtering process using both GEANT4 Monte Carlo simulations and experimental methods. This was completed using an electron motion simulation and sputtering experiments with copper and aluminum targets. These results showcased that target erosion is based on target material and magnet placement, not particle energy.
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Permanent link to this page: https://digital.wpi.edu/show/0g354j02h